Indium to launch new adhesive for power module assembly

Indium Corporation, a designer and manufacturer of materials for electronics assembly, plans to release a new adhesive for power module assembly at PCIM Europe, which is scheduled for May 10 to 12 in Nuremberg, Germany.

InTACK is a halogen-free adhesive designed to hold a die, chip or solder preform in place during the placement process and no-flux reflow processes with formic acid. The company says InTACK doesn’t need to be cleaned off because it evaporates during reflow, which saves time.

Other benefits of InTACK include precise assembly alignment, robust tacking, long working time and optimal performance in the reflow process.

Source: Indium